三星电子新设BEOL工艺组织，聚焦HBM4等高附加值内存

Odaily Planet Daily reports that Samsung Electronics' semiconductor division has recently established a BEOL (Back End Of Line) process organization within the etching technology team of its memory business unit. The team is expected to be fully formed this month and will commence operations at the Pyeongtaek campus, with an initial headcount of approximately 30 people.



Most members of this organization are senior engineers. Discussion topics will include securing BEOL process technology for high-value-added memory products such as HBM, personnel allocation, and strengthening supply chain operations.



BEOL is a backend metal wiring formation process in semiconductor front-end manufacturing. It is used to connect various devices and transmit signals after the wafer devices are formed. Samsung Electronics began shipping HBM4 in the first half of this year, which features 2,048 I/O units — double that of the previous generation.



Increasing the number of I/O units within a limited chip area requires denser wiring and smaller line widths, placing higher demands on metal wiring formation and etching precision. Since the organization is still in its early stages of formation, its specific operational direction and objectives will be clarified at a later date.